Altera Corporation · San Francisco
Mechanical & Aerospaceposted 4w ago
About Altera
At Altera™, our independence as the world’s largest pure‑play FPGA solutions provider gives us the focus, speed, and agility to innovate without compromise. With more than four decades of industry‑leading FPGA expertise, our singular mission is to deliver the programmable technologies that help customers differentiate, innovate, and scale across rapidly evolving markets like AI, cloud, networking, and edge. As an independent company, we move faster, invest deeper, and partner more closely—empowering our teams to drive breakthrough innovation and shape the future of the FPGA industry.
About the Role
We are seeking an experienced semiconductor Package Reliability Engineer responsible for characterizing and qualifying advanced 2.5D/3D semiconductor packages. This role requires partnering with package development engineers and semiconductor package assembly and manufacturing teams for selection of packaging materials based on thermal and thermomechanical characterization for advanced packaging technologies.
Key Responsibilities
Partner with package development and assembly teams for packaging materials (substrate, and assembly materials) selection to meet product thermomechanical reliability requirements
Develop and maintain advanced semiconductor package thermal and thermomechanical finite element models using commercial software (e.g., Ansys, Abaqus)
Define, execute and interpret package coplanarity, warpage, and second level reliability data collection strategies to calibrate the thermal and thermomechanical FEM models
Lead package reliability evaluations to validate package robustness as defined by industry standards such as JEDEC, MIL-STD, IPC, and AEC using test-chips and products
Understand FPGA use conditions and develop customer reports, communications related to package thermal and thermomechanical concerns.
Perform reliability lifetime prediction modeling from stress test/field data
Develop and own package DFMEA/FMEA’s partnering with development and manufacturing teams
Salary Range
The pay range below is for Bay Area California only. Actual salary may vary based on a number of factors including job location, job-related knowledge, skills, experiences, trainings, etc. We also offer incentive opportunities that reward employees based on individual and company performance.
$166,900 - $240,000 USD
We use artificial intelligence to screen, assess, or select applicants for the position. Applicants must be eligible for any required U.S. export authorizations.
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Minimum Qualifications
Master's degree in Mechanical Engineering, Materials Science, Packaging Engineering, or a related technical field with 8+ years of experience in semiconductor package thermal and thermomechanical analysis
8+ years of experience using thermal and thermomechanical simulation tools (e.g., Ansys, Abaqus, COMSOL, or equivalent) to develop and analyze warpage, coplanarity, stress, and deformation models for advanced semiconductor packages.
8+ years of experience developing, analyzing, and validating advanced semiconductor packaging technologies, including 2.5D, 3D, and heterogeneous integration packages, with a strong understanding of package reliability.
3+ years of experience applying reliability statistics, failure analysis methodologies, and lifetime modeling techniques to semiconductor packaging and product reliability assessments.
3+ years of experience developing scripts or software using Python for automation, simulation workflows, data analysis, and post-processing.
Preferred Qualifications
Deep understanding of thermal, mechanical and thermomechanical characteristics of advanced 2.5D/3D flip-chip packages
Ability to correlate between thermomechanical simulations and package dynamic warpage and package behavior in surface mount system level assembly
Develop customer facing collaterals for packaging risk assessments