Cisco · Taipei
Mechanical & Aerospaceposted 4w ago
Meet the Team
We are seeking a skilled and driven ASIC Mechanical Engineer to join Cisco ASIC Group. In this role, you will focus on mechanical and thermomechanical simulations of ASICs and complex silicon packages. Your simulations will directly facilitate product design, ensure mechanical reliability, and accelerate time to market for high-performance Cisco systems.
You will collaborate with a globally distributed team across multiple time zones, contributing to innovative, simulation-driven design across packaging, reliability, thermal, and hardware engineering groups.
Your Impact
· Perform FEA/CFD to evaluate thermal behavior, thermal mechanical, warpage, solder joint reliability of ASIC package, substrates, and advanced packaging assemblies.
· Simulate and analyze linear/nonlinear material behaviors.
· Develop and automate simulation workflows using Python, Fortran, APDL or similar scripting tools to streamline analysis and reporting.
· Provide clear simulation results to support thermal and mechanical design, root cause analysis, and risk mitigation.
· Support design optimization at early phase of product development and failure investigations by correlating FEA/CFD predictions with test data and field returns.
· Document and present analysis results, assumptions, and design recommendations in a clear, structured format.
Minimum Qualifications
Bachelors + 8 years of related experience, or Masters + 6 years of related experience, or PhD + 3 years of thermal modeling/simulation related experience.
At least 3 years of experience in mechanical principles in solving classical thermal analysis solutions both inside and outside of finite element tools and an ability to work independently and manage multiple priorities
Demonstrated experience in thermal testing: Planning, organization, execution, data reduction and correlation
Demonstrated experience in leading a team of thermal analysts on major program efforts
Hands-on experience with 3D modeling, FEA/CFD using ANSYS/Icepak or ABAQUS.
Flexibility to coordinate and communicate across different time zones, supporting global project teams in the US and Asia.
Preferred Qualifications
5+ years of experience in mechanical and thermal simulation of semiconductors or electronics packaging systems.
Proficiency in CAD, GD&T with AUTOCAD, CREO and related industry standards (JEDEC, IPC, etc.).
Experience in flip chips, 2.5D/3D, SoIC advanced packaging, and/or heterogeneous integration technologies.
Perform thermal simulations utilizing CFD/FEA tools for package, board-level solutions and present results.
We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.
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