As a Sr Staff / Principal CAD & Design Methodology Engineer, you will be the technical architect of RTL-to-GDSII flows and digital design infrastructure for advanced SoC products. You will define and deploy multi-vendor, multi-foundry design methodology platforms, lead hierarchical SoC implementation strategies, and drive low-power chiplet products. You will own the R2G (RTL-to-GDSII) system architecture spanning Intel, TSMC, Samsung, and GlobalFoundries nodes — enabling scalable, high-quality tapeouts across diverse product classes.
- 15+ years of experience in ASIC CAD, design methodology, or physical design with a proven record of leading multi-node, multi-foundry platform deployments.
- Demonstrated success deploying R2G platforms across multiple external foundry nodes (TSMC N3/N5/N7, Samsung SF3/SF4, GlobalFoundries GF12/GF22).
- Deep expertise in low-power design methodology — UPF/CPF flows, multi-voltage domain integration, retention strategy, and power domain verification.
- Proven expertise in clocking methodologies: Clock Mesh, Spine-and-Rib, H-Tree, and hybrid clock architectures with custom cell integration.
- Familiarity with chiplet and 2.5D integration methodology — die-to-die interface timing, UCIe/BoW PHY integration, and hierarchical top-level assembly flows.
- Exceptional problem-solving ability and communication skills — comfortable presenting to executive leadership and engaging directly with foundry technology teams.