Memory Design Engineer, HBM

Mechanical & Aerospace

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a leader in innovative memory and storage solutions, Micron Technology drives advancements from silicon to system-level development. The design organization partners across global engineering and manufacturing teams to deliver high‑quality, cost‑efficient, and scalable memory products that meet evolving customer needs.

The Memory Design Engineer develops and optimizes digital and analog circuits for advanced DRAM products. This role focuses on circuit design, simulation, validation, and multi-functional collaboration to ensure manufacturable, reliable, and high‑performance memory solutions while contributing to future technology innovation.

Responsibilities

Design and optimize digital, analog, and memory core circuits using CMOS technology, translating device concepts into functional solutions.
Perform circuit simulations and analyses using tools such as FINESIM, HSPICE, and VERILOG to evaluate power, performance, reliability, and parasitics.
Develop circuit floorplans including placement, routing, power distribution, timing, and die size considerations, while providing layout leadership.
Validate designs through reticle experiments, tape-out revisions, and simulation-to-silicon correlation, implementing necessary schematic updates.
Collaborate with global teams across design, verification, product engineering, test, probe, process integration, assembly, and marketing to support manufacturability, quality, and cost objectives.

Minimum Qualifications

PhD in Electrical Engineering or related field.
Strong foundation in CMOS circuit design, VLSI, and analog circuit design, including understanding of device reliability and circuit floor planning.
Proven analytical and problem-solving skills with demonstrated technical contributions and innovation.
Experience or academic exposure to circuit simulation tools such as FINESIM, HSPICE, or VERILOG.
Ability to collaborate effectively across multiple engineering functions to optimize quality, reliability, cost, and time-to-market.

Preferred Qualifications

Knowledge or experience in DRAM subsystem architecture, specification, operation, or design.
Self-motivated with strong initiative to develop innovative engineering solutions.
Understanding of semiconductor industry technologies and competitive trends.
Strong communication and interpersonal skills to support multi-functional teamwork and design reviews.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

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