Micron Folsom · Boise
Software Engineering
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Department Intro:
The Advanced Packaging organization at Micron is building the foundation for the AI era. We work at the intersection of materials, processes, and manufacturing to enable next‑generation memory and packaging technologies. Our teams collaborate closely across R&D, manufacturing, and suppliers to turn innovation into scalable, high‑quality solutions—and we enjoy solving hard problems together!
Position Overview:
As a Process Engineer focused on Advanced Packaging Photolithography, you will play a critical role in developing and optimizing lithography processes that directly impact product quality, yield, and reliability. This role offers hands‑on technical ownership, strong cross‑functional collaboration, and the opportunity to influence how advanced packaging technologies move from development into high‑volume manufacturing.
Responsibilities:
Develop and optimize photolithography processes for advanced packaging applications, including thick and ultra‑thick photoresist patterning
Drive yield improvement, defect reduction, cost optimization, and risk management using structured problem‑solving and statistical methods
Identify, diagnose, and resolve lithography‑related process issues using failure analysis, FMEA, SPC, and related methodologies
Lead process, equipment, and material evaluations and support qualification and baseline changes
Collaborate with cross‑functional teams and suppliers to enable robust integration and smooth technology transfer to manufacturing
Minimum Qualifications:
Master’s or PhD in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, or a related technical field
3+ years of experience in semiconductor photolithography or related process engineering
Strong foundation in lithography fundamentals, including resist processing, alignment, overlay, and CD control
Experience applying DOE, SPC, and data‑driven analysis to process optimization
Ability to manage multiple priorities and resolve manufacturing line issues independently and collaboratively
Preferred Qualifications:
Experience with advanced packaging or backend semiconductor technologies
Hands‑on experience with lithography tools, track systems, and lithography‑related metrology
Experience developing processes for high‑aspect‑ratio or large topography features
Familiarity with wafer thinning, plasma dicing, bonding, or packaging‑specific patterning challenges
Experience leading or influencing cross‑functional technology development initiatives
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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To learn more about Micron, please visit micron.com/careers
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